SK hynix HBM4 Production Equipment: 9.7 Billion Won Order Placed with Hanmi

A 9.7 billion won order is setting the stage for the 2026 AI memory war. SK hynix just signaled its HBM4 production timeline with a fresh equipment order from Hanmi Semiconductor.

Strategic Order for SK hynix HBM4 Production Equipment

According to regulatory filings on Wednesday, SK hynix has placed an order for thermo-compression (TC) bonders worth 9.7 billion won ($6.5 million). These units, expected to be the TC Bonder 4 model, are specifically designed for stacking chips to produce next-generation HBM4 products. Hanmi Semiconductor plans to complete the delivery by April 2026.

With a single TC bonder typically priced at around 3 billion won, industry watchers estimate the deal covers approximately three units. This procurement is a vital step for SK hynix's expansion at its production base in Cheongju, located 110 kilometers south of Seoul, as it gears up for the commercialization of advanced memory for AI.

Preparing for the HBM4 Era

The memory giant hasn't been shy about its ambitions. Earlier this month, SK hynix stated it aims to lead the sector in 2026 by maintaining its HBM3E dominance while building the HBM4 ecosystem. The company also showcased its advanced 16-layer HBM4 chip at CES 2026, signaling that the hardware transition is already well underway.