SK hynix 16-layer HBM4 CES 2026 Debut Replaces AI Memory Limits
SK hynix unveiled its groundbreaking 16-layer HBM4 with 48GB capacity at CES 2026. Discover how their partnership with Nvidia is shaping the future of AI memory.
The ceiling for AI memory performance has just been shattered. SK hynix is showcasing its latest breakthrough, a 16-layer HBM4 chip, at CES 2026, solidifying its dominance in the high-stakes AI memory market.
Technical Edge of SK hynix 16-layer HBM4 CES 2026 Reveal
Unveiled at the Venetian Expo, this powerhouse features a massive 48GB capacity. It's a significant upgrade from the company's previous 12-layer HBM4 model, which offered 36GB. According to Yonhap News, the new model's development is aligned with key customer schedules to meet the surging demands of next-gen AI processing.
Deepening the Nvidia Partnership
The bond between SK hynix and Nvidia was on full display. The showroom featured an Nvidia GPU module equipped with HBM3E, the current industry standard. Reports indicate that CEO Kwak Noh-jung met with Nvidia officials on Monday to discuss strategic cooperation, signaling that their alliance remains unshakable.
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