華為新機中國零件佔比達60%!拆解報告揭示美國制裁下的「紅色供應鏈」崛起
最新拆解報告顯示,華為Pura 80 Pro手機的中國製零組件佔比已近60%,揭示在美國制裁壓力下,中國的半導體自主化與「紅色供應鏈」正加速崛起。
60%的逆襲!一份最新的拆解報告顯示,在美國出口管制下,華為(Huawei Technologies)新款智慧型手機的中國製零組件價值佔比已近六成。這不僅是華為的絕地反攻,更是中國半導體自主化進程中一個舉足輕重的里程碑。
Pura 80 Pro拆解:國產化率的真相
根據日經新聞2025年12月25日發布的拆解分析,華為最新的「Pura 80 Pro」手機,按價值計算的國產零組件比例高達57%。這一數據明確顯示,自美國實施嚴格的出口限制以來,華為已在供應鏈本土化方面取得長足進展。
尤其值得注意的是,在CPU(中央處理器)和記憶體晶片等核心組件上,國產化的進程突飛猛進。這意味著中國的科技自主戰略,已從政策口號轉化為能夠在市場上競爭的實體產品。
制裁反成催化劑?中國加速技術自主
這股趨勢並非僅限於華為。報導指出,中國正推動國有AI數據中心優先採用國產晶片,顯示出全國性的供應鏈重組決心。美國的制裁意在削弱中國的科技實力,但從目前看來,它反而成為一股強大的外部壓力,迫使中國加速建立獨立自主的技術生態系統。
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